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Chemical Week Magazine :: Specialty Chemicals
Dow Adds Metallization Capacity
6:58 AM MDT | November 4, 2011
Dow Chemical says its electronic materials business unit is constructing a manufacturing and testing facility for metallization materials used in advanced chip packaging at Cheonan, Korea. The facility is expected to be operational in the second quarter of 2012. Chip packaging is increasingly important to electronics as the demand for more functionality in the same or smaller footprint grows, Dow...
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