![]() |
|
searchpremium serviceseventsdirectory servicesadvertisingcustomer care |
Chemical Week Magazine :: Specialty Chemicals 3M Opens Wafer Bonding Lab10:48 AM MDT | July 8, 2011 3M says it has opened an application lab at Yangmei, Taiwan for 200mm and 300mm temporary bonding. Temporary bonding is crucial in the 3D packaging process to temporarily bond the wafers during manufacturing and then debond them without... This information is only available to Chemical Week subscribers. Forgot your user ID or password?
|
Not an IHS Chemical Week
|
Connect with IHS Chemical Week |
Quick links |
Our related sites |
|
contact us | about us |
customer care |
privacy policy |
sitemap |
advertise
|