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Chip makers, suppliers face technical hurdles ‘Mobile Era’ driving new architectures

9:03 AM MDT | July 29, 2013 | —Rebecca Coons

The semiconductor industry is faced with daunting technical and cost hurdles as it navigates shorter innovation cycles and new chip architectures, according to attendees of Semicon West, held in early July at San Francisco. Unprecedented levels of materials development is required to ensure fabricators can produce chips that meet consumer demand for cutting-edge gadgets, speakers said....

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