People & Business :: Companies
DuPont Electronic Technologies, Nippon Kayaku Jointly to Develop WLP Materials
5:40 AM MST | February 4, 2009 | Rebecca Coons
Materials market for wafer level packaging and 3D/TSV to grow from about $100 million in 2009, to more than $600 million in 2013....
This information is only available to Chemical Week subscribers.
Forgot your user ID or password?
Not an IHS Chemical Week member yet?
Here's why you should be:
100% Satisfaction Guarantee