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BASF, IBM Codevelop Advanced Copper Plating Chemistry for Integrated Circuits

8:08 AM MDT | April 22, 2010 | Alex Scott

BASF says, in collaboration with IBM, it has created advanced copper plating technology for making current- and future-generation microchips. The chemistry enables very fast, defect-free ‘superfill’ for the electrochemical deposition of copper, resulting in higher reliability and better quality of chips, BASF says.   The two companies are extending their cooperation in order to set up the parameters for mass production of microchips using the technology. BASF says it expects to commercialize the technology, including related technology, chemicals...

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