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3M Opens Taiwan Wafer Bonding Application Lab

3:45 PM MDT | June 30, 2011 | Rebecca Coons

3M says it has opened an application lab at Yangmei, Taiwan for 200mm and 300mm temporary bonding. The center offers Asian customers access to 3M's materials and processes for temporary bonding for ultra-thin wafer handling applications for 3D integrated circuit (IC) packaging. Temporary bonding is crucial in the 3D packaging process to temporarily bond the wafers during manufacturing and then debond them without...

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