IHS Chemical Week

EnviroTech :: R&D

R&H and IBM Team Up for Next-Gen Chip Technology

12:14 PM MST | March 3, 2008 | Michelle Bryner

Rohm and Haas (R&H) says it has entered into two agreements with IBM to jointly develop materials and processes for next-generation chips. Both collaborations will focus on enabling 32-nanometer (nm) and 22-nm node devices. Financial terms were not disclosed. Incredibly shrinking chip: Big challenges lie ahead. R&H and IBM are working together as well as independently to meet the requirements for next-generation chips. The shrinking node size, which represents the minimum feature size of an integrated circuit, has enabled more features to be packed into a...

This information is only available to Chemical Week subscribers.

Username:
Password:

Forgot your user ID or password?
Click here to have it sent to you.

Risk Free Trial

Email Address

First Name

Last Name

Click here to register and get your RISK-FREE access to chemweek.com

Not an IHS Chemical Week
24/7 member yet?

Here's why you should be:

  • Searchable online archive access of the last 2 years of Chemical Week.
  • Print or digital magazine subscription
  • Price and market change alerts
  • Economic data and statistics
  • Buyers' Guides
  • Webcasts | whitepapers

 

 

 













 
contact us | about us | customer care | privacy policy | sitemap | advertise

ihsCopyright © 2012 IHS, Inc. All rights reserved. Reproduction in whole or in part without permission is prohibited.

North Asia Russia Southeast Asia China India/Pakistan Middle East Eastern Europe Western Europe Central America Canada USA Australia/New Zealand South America Africa