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EnviroTech :: R&D

R&H and IBM Team Up for Next-Gen Chip Technology

12:14 PM MST | March 3, 2008 | Michelle Bryner

Rohm and Haas (R&H) says it has entered into two agreements with IBM to jointly develop materials and processes for next-generation chips. Both collaborations will focus on enabling 32-nanometer (nm) and 22-nm node devices. Financial terms were not disclosed. Incredibly shrinking chip: Big challenges lie ahead. R&H and IBM are working together as well as independently to meet the requirements for next-generation chips. The shrinking node size, which represents the minimum feature size of an integrated circuit, has enabled more features to be packed into a...

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