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EnviroTech :: R&D DuPont Joins Holst Centre Printed Electronics Development Program4:36 PM MST | December 5, 2011 | Rebecca Coons DuPont MCM says it will concentrate on optimizing printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low energy sintering.... This information is only available to Chemical Week subscribers. Forgot your user ID or password?
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